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Semiconductor Systems CSP-3000™ ZVS-200P™ ZVS-200S™ HZ6000™ Nano-3™

Semiconductor Systems

Nano-3 for Bump Metrology Singulated Part, Strip, Panel and Wafers ZYGO's semiconductor metrology systems enable manufacturers to improve the quality and yield of their processes, while lowering metrology costs.

Metrology, Process Control and
Manufacturing Inspection Equipment

CSP-3000™ – 100% inspection of flip-chip CSP (FC-CSP) strips. Inspects a mixture of round and flat bumps in a single measurement – the only inspection tool capable of measuring both.

ZVS-200P™ – In-tray inspection of 3D/2D/marking/Package Visual Inspections (PVI), with the highest throughput in the industry – up to 120,000 units per hour.

ZVS-200S™ – Fully automatic, in-tray inspection of flip-chip substrates. Dedicated to C4 round and flat bumps inspection, ZVS-200S features high accuracy, and throughput that leads the industry.

HZ6000™ – Third-generation 3D vision system, designed for 100% inspection of singulated flip-chip substrates in high-volume production. Inspects C4 round and flattened bumps, measuring volume, height, diameter, coplanarity and warpage.

Nano-3™ – Powered by Zygo's patented FMI-3™ technology, Nano-3 provides the highest precision 3D/2D Semiconductor Package Inspection System for C4, BGA, LGA and All Bumps and Pads.

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Contact ZYGO today to learn more about ZYGO's metrology solutions for Semiconductor package manufacturing!