ZYGO's semiconductor metrology systems enable manufacturers to improve the quality and yield of their processes, while lowering metrology costs.
Metrology, Process Control and
CSP-3000™ – 100% inspection of flip-chip CSP (FC-CSP) strips. Inspects a mixture of round and flat bumps in a single measurement – the only inspection tool capable of measuring both.
Manufacturing Inspection Equipment
ZVS-200P™ – In-tray inspection of 3D/2D/marking/Package Visual Inspections (PVI), with the highest throughput in the industry – up to 120,000 units per hour.
ZVS-200S™ – Fully automatic, in-tray inspection of flip-chip substrates. Dedicated to C4 round and flat bumps inspection, ZVS-200S features high accuracy, and throughput that leads the industry.
HZ6000™ – Third-generation 3D vision system, designed for 100% inspection of singulated flip-chip substrates in high-volume production. Inspects C4 round and flattened bumps, measuring volume, height, diameter, coplanarity and warpage.
Nano-3™ – Powered by Zygo's patented FMI-3™ technology, Nano-3 provides the highest precision 3D/2D Semiconductor Package Inspection System for C4, BGA, LGA and All Bumps and Pads.
CP7300™ – Measures 3D surface height, roughness, and local area planarity and uniformity measurements on wafers for rapid, quantitative characterization of photo-lithographic, etch, and polishing process effects. Fast, non-contact, and automated.
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