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HZ6000™ Fully Automatic High-Speed Metrology for Singulated Flip-Chip Substrate
Total quality control for flip-chip substrate manufacturers.
Large area sensor for market-leading throughput.
Standalone or inline configurations available.
Pinned substrate configuration available.
Supports industry-standard or custom trays.
High Speed / High Accuracy modes.
Extensive 2D/3D metrology for flattened and round bumps.
Zygo's HZ6000 third-generation vision system is an innovation in true 3D measurement for substrate manufacturers, designed for 100% inspection of singulated flip-chip substrates.
The HZ6000 is the most accurate 3D system for inspecting C4 round and flattened bumps, measuring volume, height, diameter, coplanarity and warpage in high-volume production.
Powered by FMI2™ TechnologyInspired by the principles of moire interferometry, Zygo's Fast Moiré Interferometry (FMI™) technology captures X, Y and Z measurements for every pixel with unmatched accuracy, repeatability and throughput.
Pushing further the limits of precision, FMI2 Technology is the next generation of Moiré based 3D measurements. Using a high speed, high-resolution camera in combination with shadow-free, multi-angle pattern projection, FMI2 technology analyzes the entire field-of-view to obtain 3D and 2D measurements of C4 bumps, regardless of surface type and the presence of defects.
Inquiry FormPlease use the form below to contact us with any questions you have regarding the HZ6000, or any of Zygo's Semiconductor Systems products.
Contact ZYGO today to learn more about the HZ6000!
Zygo® measures surfaces of microbial biofilms, PTFE nanocomposite films & silver tantalate coatings, with high precision #STLE2013 Booth 221
Zygo® 3D optical surface profilers measures microsurface features with nanometer-scale precision. #STLE2013 Booth 221
#STLE2013 Zygo Booth 221 for high-precision quantitative 3D measurements of surfaces and microstructural properties.