Semiconductor Systems CSP-3000™ ZVS-100P™ ZVS-200S™ HZ6000™ Nano-3™ CP7300™
HZ6000™ Fully Automatic High-Speed Metrology for Singulated Flip-Chip Substrate
• Total quality control for flip-chip substrate manufacturers.
• Industry-leading accuracy/repeatability.
• Large area sensor for market-leading throughput.
• Standalone or inline configurations available.
• Pinned substrate configuration available.
• Supports industry-standard or custom trays.
• High Speed / High Accuracy modes.
• Extensive 2D/3D metrology for flattened and round bumps.
Zygo's HZ6000 third-generation vision system is an innovation in true 3D measurement for substrate manufacturers, designed for 100% inspection of singulated flip-chip substrates.
The HZ6000 is the most accurate 3D system for inspecting C4 round and flattened bumps, measuring volume, height, diameter, coplanarity and warpage in high-volume production.
Powered by FMI2™ Technology
Inspired by the principles of moire interferometry, Zygo's Fast Moiré Interferometry (FMI™) technology captures X, Y and Z measurements for every pixel with unmatched accuracy, repeatability and throughput.Pushing further the limits of precision, FMI2 Technology is the next generation of Moiré based 3D measurements. Using a high speed, high-resolution camera in combination with shadow-free, multi-angle pattern projection, FMI2 technology analyzes the entire field-of-view to obtain 3D and 2D measurements of C4 bumps, regardless of surface type and the presence of defects.
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