Semiconductor Systems CSP-3000™ ZVS-100P™ ZVS-200S™ HZ6000™ Nano-3™ CP7300™
Bump Metrology Singulated Part, Strip, Panel and Wafers
Nano-3™
• Integrating ZYGO's new FMI-3 technology for best available accuracy
• Complete 2D/3D bump metrology
• Supports singulated part, strip, panel, and wafer formats
• Flexible platform supports C4, BGA, LGA, SGA, QFN, QFP, SPI, CSP, and other types of bumps & pad inspection
• All types of FMI sensors available
Highest Precision 3D/2D Semiconductor Package Inspection System for C4, BGA, LGA and All Bumps and Pads
Inspection of all package types for process monitoring, quality control, and new product development using semi-automatic vision technology. Based on Zygo's new FMI-3 inspection technology. Zygo's Nano-3 is an industry-leading precision inspection tool.The flip-chip substrate industry faces an important challenge with today's ongoing trends toward decreasing feature sizes and higher I/O requirements. The flip-chip substrate industry must achieve greater quality through improved process control in substrate manufacturing production.
C4, BGA, LGA, SGA, QFN, QFP, SPI, CSP Bumps Inspected
Whether C4, BGA or any of the current bump and ball types for semiconductor packaging are supported by this flexible platform. Nano-3 is ready to meet the challenge of reduced packaging feature sizes, with higher quality. It provides industry leading accuracy and repeatability for the inspection of packages whether on production tray, strip, panel or wafer. Customers use Nano-3's flexibility for multiple tool process control and new product development at best cost of ownership.Powered by FMI-3™ Technology
Inspired by the principles of moiré interferometry, Zygo's patented Fast Moiré Interferometry™ (FMI™) technology captures X, Y and Z measurements for every pixel with unmatched accuracy, repeatability and throughput.
In the next generation of Moiré based 3D measurements, FMI-3 Technology uses a high speed, high-resolution camera in combination with shadow-free, multi-angle pattern projection. FMI-3 technology analyzes the entire field-of-view to obtain 3D and 2D measurements of C4 bumps, regardless of surface type and the presence of defects.
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