In-tray HVM Inspection

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Semiconductor Systems CSP-3000™ ZVS-200P™ ZVS-200S™ HZ6000™ Nano-3™

HVM In-tray Inspection Solution for IC Packages

HVM In-tray Inspection Solution for IC Packages ZVS-200P

Key Features:

• 3rd generation design with market dominating performance and added robustness

• New Large Field-of-View (LFOV) FMI™ sensor head with all-in-one 3D/2D/Marking/inspections

• Unconstrained true bump height/coplanarity/warpage measurements

• Parts measured in-tray with minimal handling

• Industry leading throughput (up to 120,000 UPH)

• Production floor proven lowest cost of ownership

• Flexible automation platform supporting most types of IC package: BGA, QFN, QFP, LGA, SGA, PGA, PoP, and their derivatives

• Smart sorting station ensures industry leading throughput

• SECS/GEM and SEMI S2-S8 compliance available on request

Zygo Corporation introduces an even faster fully-automatic in-tray vision system for inspection of IC packages. Enabled by patented Fast Moire Interferometry (FMI™) technology, ZYGO's ZVS-200P vision system provides 3D/2D/Marking/PVI inspection at industry leading throughput, accuracy, and measurement reliability.

With today's ongoing trends in decreasing feature sizes and higher I/O requirements, the ICpackage industry faces an important challenge of achieving greater quality through improved process control in package manufacturing production. Based on the ground-breaking ZVS-100P, the ZVS-200P vision system further pushes down the cost of inspections by meeting that challenge with industry leading accuracy and repeatability at the fastest throughputs available on the market.

The ZVS-200P vision system is designed for the inspection of IC package units in-tray. This allows for a faster tool, superior metrology performance, and unconstrained package inspection. The end result is improved quality control at best cost of ownership.

Automation and Speed for Low CoO

The ZVS-200P is designed for inspections of IC package units in production trays. A smart sorting station provides high speed throughput. This allows for a faster tool, better metrology measurements and unconstrained package inspection.

With high accuracy, even next-generation small features can be inspected. The end result is total quality control for the IC pack manufacturers at best cost of ownership.

Inquiry Form
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Contact ZYGO today to learn more about the ZVS-200P™!