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Optical Surface Profilers
Laser Interferometers
Semiconductor Systems
Stage Position Metrology
Testing & Certification Services
CSP-3000™
ZVS-100P™
ZVS-200S™
HZ6000™
Nano-3™
CP7300™
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In-tray Inspection of FC Substrates ZVS-200S™
Key Features:
Industry leading throughput: > 5,000 UPH
FMI-3 2D/3D high accuracy sensor
Parts measured in-tray with minimal handling
Advanced C4 bump inspection for Solder Paste, Micro-ball, Cu-Pillar and other processes
Flexible platform supporting bumps on Coreless BGA, PGA, SGA
Extensive 2D/3D metrology for flattened and round bumps
Unconstrained coplanarity/warpage measurements
Capable of SEMI, SECS/GEM and S2-S8 compliant
Flip-chip substrate inspection is fully automatic and in-tray. Dedicated to C4 round and flat bumps inspection, ZVS-200S features high accuracy, and throughput that leads the industry. As it trends toward decreasing feature sizes and higher I/O requirements, the flip-chip substrate industry faces an important challenge: achieving greater quality through improved process control in substrate manufacturing production.
Highest Throughput Singulated Flip-Chip Inspection
Inspecting singulated substrates in production trays is the mode for which ZVS-200S designed, meeting the industry's challenges with leading accuracy and repeatability at never before achieved throughputs. It is a faster tool, with better metrology and unconstrained warpage inspection. With higher speed and accuracy, ZVS-200S offers total quality control and lower cost of ownership for the flip-chip substrate manufacturer.
Powered by FMI-3 Technology
Inspired by the principles of moire interferometry, Zygo's patented Fast Moire Interferometry™ (FMI™) technology captures X, Y and Z measurements for every pixel with unmatched accuracy, repeatability and throughput.
In the next generation of Moire based 3D measurements, FMI-3 Technology uses a high speed, high-resolution camera in combination with shadow-free, multi-angle pattern projection. FMI-3 technology analyzes the entire field-of-view to obtain 3D and 2D measurements of C4 bumps, regardless of surface type and the presence of defects.
Inquiry Form
Please use the form below to contact us with any questions you have regarding the ZVS-200S, or any of Zygo's Semiconductor Systems products.
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Contact ZYGO today to learn more about the ZVS-200S™!


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