In-Tray FC Substrate Inspection

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Semiconductor Systems CSP-3000™ ZVS-100P™ ZVS-200S™ HZ6000™ Nano-3™ CP7300™


In-tray Inspection of FC Substrates
ZVS-200S™

FC-BGA Inspection In-Tray with ZVS-200S

Key Features:

• Industry leading throughput: > 5,000 UPH

• FMI-3 2D/3D high accuracy sensor

• Parts measured in-tray with minimal handling

• Advanced C4 bump inspection for Solder Paste, Micro-ball, Cu-Pillar and other processes

• Flexible platform supporting bumps on Coreless BGA, PGA, SGA

• Extensive 2D/3D metrology for flattened and round bumps

• Unconstrained coplanarity/warpage measurements

• Capable of SEMI, SECS/GEM and S2-S8 compliant

Flip-chip substrate inspection is fully automatic and in-tray. Dedicated to C4 round and flat bumps inspection, ZVS-200S features high accuracy, and throughput that leads the industry. As it trends toward decreasing feature sizes and higher I/O requirements, the flip-chip substrate industry faces an important challenge: achieving greater quality through improved process control in substrate manufacturing production.

Highest Throughput Singulated Flip-Chip Inspection

Inspecting singulated substrates in production trays is the mode for which ZVS-200S designed, meeting the industry's challenges with leading accuracy and repeatability at never before achieved throughputs. It is a faster tool, with better metrology and unconstrained warpage inspection. With higher speed and accuracy, ZVS-200S offers total quality control and lower cost of ownership for the flip-chip substrate manufacturer.

Powered by FMI-3 Technology

Inspired by the principles of moire interferometry, Zygo's patented Fast Moire Interferometry™ (FMI™) technology captures X, Y and Z measurements for every pixel with unmatched accuracy, repeatability and throughput.

In the next generation of Moire based 3D measurements, FMI-3 Technology uses a high speed, high-resolution camera in combination with shadow-free, multi-angle pattern projection. FMI-3 technology analyzes the entire field-of-view to obtain 3D and 2D measurements of C4 bumps, regardless of surface type and the presence of defects.

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