AMETEK, Inc. Logo
About Us Company Profile What's New at ZYGO? Upcoming Events History Manufacturing Locations Sales/Service Offices Careers How to Get to ZYGO Patent Information ISO Registrations Conflict Minerals Policy Privacy and Cookie Policy Terms & Conditions
Please Note: Zygo Corporation is conducting business as usual; however most offices are closed to non-employees and are operating with reduced on-premises staffing in compliance with COVID-19 social distancing practices. Please contact us with any questions, and prior to shipping materials to any of our locations.

News Release
September 16, 1999

ZYGO Introduces the New ZYGO CP 200wl Critical Planarity Measurement System for Semiconductor Wafer Metrology

September 16, 1999, Middlefield, Conn. - Zygo Corporation, a world leader in high performance surface metrology systems, today announces a new wafer metrology tool, the ZYGO CP 200wl Critical Planarity Measurement System. Using proprietary interferometric optical scanning technology, the ZYGO CP 200wl provides high spatial resolution, nanometer scale surface height and planarity measurements. The ZYGO CP 200wl allows semiconductor manufacturers faster process development and precision process control during production for parametric control and optimization of the chemical mechanical polishing (CMP) process. As a consequence, the CP 200wl improves the performance of the lithography process for critical linewidths and film thicknesses. The unit's performance is field proven with successful installation at a leading semiconductor manufacturer.

The ZYGO CP 200wl provides noncontact, automated, and high-performance 3D surface height and planarity measurements on wafers for rapid characterization and quantification of photolithographic, etch, and polishing process effects. Applications include surface measurements of planarity, uniformity, step-heights of structures, and microroughness.

Programmable automated measurement sequencing and positioning allows for surface characterization at multiple sites and wafer locations. Integral to each system is a comprehensive and powerful software analysis package with application-specific modules, providing full 3D imaging and data reporting of many surface topography parameters.

" As device design rules shrink, localized wafer planarity becomes a critical concern. The ZYGO CP 200wl provides our semiconductor customers with the tools required to advance devices into the new millennium, and represents the first of a new generation of products ZYGO is developing for this marketplace," said John Roth, product marketing manager.

Zygo Corporation designs, develops, manufactures, and markets high performance measurement and yield improvement instruments, systems, and accessories used in high technology industries. The Company is headquartered in Middlefield, Connecticut, and also has operations in Asslar, Germany; Longmont, Colorado; and in Newbury Park, Sunnyvale, and Simi Valley, California.

This press release may contain forward-looking statements within the meaning of Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, which reflect the Company's current judgment on certain issues. Because such statements apply to future events, they are subject to risks and uncertainties that could cause the actual results to differ materially. Important factors which could cause actual results to differ materially are described in the Company's reports on Form 10-K and 10-Q on file with the Securities and Exchange Commission.

By continuing to use this site, you agree to our Privacy and Cookie Policy. OK

What's New at ZYGO?
Social Media Icons LinkedIn Twitter Facebook YouTube
National Flags
  Privacy and Cookie Policy        Privacy Policy Inquiry Form        Unsubscribe
× Enter the email address you would like to unsubscribe from future contact...


Or, if you have a question, please use our Privacy Policy Inquiry form.