|ZYGO Ships First Automated Semiconductor Packaging Metrology System|
|MIDDLEFIELD, CT--(MARKET WIRE)--Apr 13, 2004 -- Zygo Corporation (NasdaqNM:ZIGO - News) announced today that it has shipped the first of its CP300 optical metrology systems to incorporate its powerful TopSlice™ thin film measuring technology. The system was shipped to a major US chip maker under a purchase agreement that makes provision for the delivery of up to five identical units. The unique technology is of broad interest for advanced chip packaging processes. To control such processes it is increasingly important to make rapid, noncontact measurements of topographical features, such as solder bumps and laser scribes in the presence of thin transparent layers.
"This our first standalone metrology tool for in-line semiconductor process control," said Robert Stoner, ZYGO's Vice-President for Metrology and Optical Systems. "Our broad technology base, and reputation for precision and reliability have already firmly established ZYGO as the leader in optical metrology among the world's top lithography OEMs. They depend on our products both to measure the world's most challenging optics, and to control wafer placement inside their steppers. The advances we have recently made in the area of optical measurements of topography on patterned wafers meet a clear need in the chip packaging industry. This shipment marks the beginning of an exciting new phase for the Company."
Zygo Corporation (NasdaqNM:ZIGO - News), headquartered in Middlefield, Connecticut, is a worldwide supplier of optical metrology instruments, precision optics, and electro-optical design and manufacturing services, serving customers in the semiconductor capital equipment and industrial industries. See ZYGO's web site at www.zygo.com for additional information.
All statements other than statements of historical fact included in this news release regarding the Company's financial position, business strategy, plans, anticipated growth rates, and objectives of management of the Company for future operations are forward-looking statements. Forward-looking statements are intended to provide management's current expectations or plans for the future operating and financial performance of the Company based upon information currently available and assumptions currently believed to be valid. Forward-looking statements can be identified by the use of words such as "anticipate," "believe," "estimate," "expect," "intend," "plans," "strategy," "project," and other words of similar meaning in connection with a discussion of future operating or financial performance. Actual results could differ materially from those contemplated by the forward-looking statements as a result of certain factors. Among the important factors that could cause actual events to differ materially from those in the forward-looking statements are fluctuations in capital spending in the semiconductor industry, fluctuations in net sales to our major customer, manufacturing and supplier risks, dependence on new product development, rapid technological and market change, international operations, dependence on proprietary technology and key personnel, length of the sales cycle, environmental regulations, and changes in expected costs of discontinued operations. Further information on potential factors that could affect Zygo Corporation's business is described in the Company's reports on file with the Securities and Exchange Commission, including its Form 10-K for the fiscal year ended June 30, 2003.
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